In the semiconductor industry the compact sensors from SONOTEC play an important role in wafer manufacturing. In different wet processes several abrasive, adherent, corrosive, and ultra-pure liquids are used. The advantage of the sensors is their non-invasive and non-intrusive measurement. Therefore they are ideal to both flow measurement and air bubble detection.
Benefits of Non-Contact Measurement
- Contact- and contamination-free process monitoring
- Applicable for a wide range of media
- Simple tube insertion
- Simple retrofit
- No equipment downtime in case of sensor exchange
- No risk of leakages
- No wear and tear
- Improved and more reliable plant productivity leads to improved yield
Flow Measurement & Air Bubble Detection in the Semiconductor Industry
If a cleaning solution is under- or overdosed, additional resources are required, since the cleaning process needs to be repeated. At worst, the wafers must be discarded and a huge loss in value is incurred. A precise flow measurement is therefore decisive for an efficient use of the production resources.
The presence of air bubbles in critical processes can have extensive consequences in wafer manufacturing. In photolithography the occurrence of air bubbles in photoresist may cause a defect of the wafers; air bubbles in process coolant may lead to an interruption of production processes. A timely detection of air bubbles is therefore crucial to achieve production targets.